XH-6000SI 全自动半导体去蜡清洗设备

XH-6000SI Automatic Removing Wax Cleaning Machine for Semiconductor Wafer 

产品特点：

1、主要用于半导体晶圆2”、3”、4“、6”的除蜡和清洗。

2、清洗槽为双层结构，外槽为SUS316, 内槽为石英槽GE214。

3、骨架材料不锈钢，外包板和门板为德国进口PP板，观察窗为透明PVC。

4、外围直接连接药液供给设备、纯水设备。

5、外槽有超声波和内槽有抛动系统，辅助设备清洗。

6、采用伺服电机、导轨、丝杆提升、横移，运行更稳定，准确。

7、输送精准≤0.3mm,温控精度≤0.5℃。

8、装有排气系统，确保环境条件。

9、PLC全程序控制及触摸屏人机界面操作。

Features:

1、Used for semiconductor wafer such as 2”,3”,4“,6”removing wax and cleaning.

2、Tank is two layers,the outer layer is made of SUS316,stainless steel,the internal layer is made of quartz.

3、Frame is made of stainless square tube,the sealed plate is made of PP plate and the windows is made of transparent PVC plate,material is made in Germany.

4、Can directly connected to cleaning agent unit and DI water system.

5、Ultrasonic device in the external tank and up and down shaking device in the internal tank is the auxiliary of machine. 

6、It runs more stable and reliable using manipulator transporting by actuating motor ,screw rod and lead rail.

7、Position precision≤0.3mm and temperature precision≤0.5℃.

8、Waste gas exhausting system,the environment is good.

9、PLC control,Touch screen HMI operation.