XH—1100SH半导体硅晶圆片湿法清洗线

XH-1100SH semiconductor silicon wafer wet cleaning line

产品特点：

1、用于半导体RCA工艺和SiC晶圆片工艺的清洗、腐蚀和干燥。

2、多轴移载式机械手，运行平稳可靠，工作效率高。

3、采用高频超声波清洗，提高硅片表面洁净度。

4、采用石英、PVDF及PP等材质的槽体，满足不同的清洗药液。

5、采用非接触是加热，确保品质的和安全。

6、配有药液恒温循环系统。

7、自动酸碱度配比功能。

Features:

1、Used for the cleaning,corrosion and drying of semiconductor RCA process and SiC wafer process;

2、Multi-axis shifting manipulator,running smoothly and reliably,with high efficiency;

3、Clean by use of high frequency ultrasonic to improve the cleanliness of the surface of the silicon chip;

4、Use the slots of the materials such as quartz,PVDF and PP and so on to meet the requirements of different cleaning liquids.

5、Non-contact heating is adopted to ensure quality and safety.

6、Equipped with a medicine liquid thermostatic circulation system;

7、Automatic PH ratio function